Cita APA (7th ed.)

SpringerLink (Online service), Iacopi, F., & Balestra, F. (2023). More-than-Moore Devices and Integration for Semiconductors (1st ed. 2023.). Springer International Publishing : Imprint: Springer. https://doi.org/10.1007/978-3-031-21610-7

Cita Chicago (17th ed.)

SpringerLink (Online service), Francesca Iacopi, i Francis Balestra. More-than-Moore Devices and Integration for Semiconductors. 1st ed. 2023. Cham: Springer International Publishing : Imprint: Springer, 2023. https://doi.org/10.1007/978-3-031-21610-7.

Cita MLA (9th ed.)

SpringerLink (Online service), et al. More-than-Moore Devices and Integration for Semiconductors. 1st ed. 2023. Springer International Publishing : Imprint: Springer, 2023. https://doi.org/10.1007/978-3-031-21610-7.