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More-than-Moore Devices and Integration for Semiconductors

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applicat...

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Korporativní autor: SpringerLink (Online service)
Další autoři: Iacopi, Francesca (Editor), Balestra, Francis (Editor)
Médium: Elektronický zdroj E-kniha
Jazyk:angličtina
Vydáno: Cham : Springer International Publishing : Imprint: Springer, 2023.
Vydání:1st ed. 2023.
Témata:
Electronic circuits.
Electronics.
Solid state physics.
Electronic Circuits and Systems.
Electronics and Microelectronics, Instrumentation.
Electronic Devices.
On-line přístup:https://doi.org/10.1007/978-3-031-21610-7
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Obsah:
  • Introduction
  • TSV and interposers
  • Interconnects, including optical
  • Simulations and reliability
  • Sensors and cameras
  • Integrated power sources
  • Energy harvesters and power management
  • Flexible and wearable electronics
  • Photonics and/ or Antennas with metamaterials
  • Neuromorphic computing for IoT
  • Brain-computer interfaces.

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