Buchumschlag

Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40 /

This book describes the latest progress in reliability analysis of microelectronic products. The content grows out of an EU project, named Intelligent Reliability 4.0 - iRel40 (see www.irel40.eu ). Different industrial sectors and topics are covered, such as electronics in automotive, rail transport...

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Bibliographische Detailangaben
Körperschaft: SpringerLink (Online service)
Weitere Verfasser: van Driel, Willem Dirk (HerausgeberIn), Pressel, Klaus (HerausgeberIn), Soyturk, Mujdat (HerausgeberIn)
Format: Elektronisch E-Book
Sprache:Englisch
Veröffentlicht: Cham : Springer International Publishing : Imprint: Springer, 2024.
Ausgabe:1st ed. 2024.
Schlagworte:
Electronic circuits.
Electronic circuit design.
Solid state physics.
Electronic Circuits and Systems.
Electronics Design and Verification.
Electronic Devices.
Online-Zugang:https://doi.org/10.1007/978-3-031-59361-1
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Inhaltsangabe:
  • Chapter 1. Material characterization
  • Chapter 2. Smart optical inline metrology
  • Chapter 3. Automated classification of semiconductor defect density SEM images using deep learning
  • Chapter 4. An Artificial Intelligence-based Framework for Burn-in Reduction in the Semiconductor Manufacturing Industry
  • Chapter 5. An Artificial Intelligence-based Framework for Burn-in Reduction in the Semiconductor Manufacturing Industry
  • Chapter 6. Early Lifetime Estimation for Automotive Lidar using Realistic L4 Usage Profiles
  • Chapter 7. Improving the reliability of automotive sensors
  • Chapter 8. Reliability improvements for in-wheel motor
  • Chapter 9. Big Data Streaming and Data Analytics Infrastructure for Efficient AI-Based Processing
  • Chapter 10. An Outlook on Power Electronics Reliability and Reliability Monitoring
  • Chapter 11. Digital Twin Technology in Electronics
  • Chapter 12. A Framework for Applying Data-driven AI/ML Models in Reliability. Chapter 13. Health monitoring fatigue properties of solder Interconnects in LED drivers
  • Chapter 14. Compiling Hybrid Models for embedded architectures using TensorflowLite for Microcontrollers
  • Chapter 15. Design support for reliable integrated circuits
  • Chapter 16. Outlook: the future of reliability.

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