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VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers /

This book contains revised and extended versions of a selection of papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16–18, 2023. T...

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-д хадгалсан:
Номзүйн дэлгэрэнгүй
Байгууллагын зохиогч: SpringerLink (Online service)
Бусад зохиолчид: Elfadel, Ibrahim (Abe) M. (Засварлагч), Albasha, Lutfi (Засварлагч)
Формат: Цахим Цахим ном
Хэл сонгох:англи
Хэвлэсэн: Cham : Springer Nature Switzerland : Imprint: Springer, 2024.
Хэвлэл:1st ed. 2024.
Цуврал:IFIP Advances in Information and Communication Technology, 680
Нөхцлүүд:
Computer engineering.
Computer networks .
Software engineering.
Computers.
Computer Engineering and Networks.
Software Engineering.
Computer Hardware.
Онлайн хандалт:https://doi.org/10.1007/978-3-031-70947-0
Шошгууд: Шошго нэмэх
Шошго байхгүй, Энэхүү баримтыг шошголох эхний хүн болох!
Агуулга:
  • Architectures
  • Synthesis of SFQ Circuits with Compound Gates
  • Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures
  • A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories
  • Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure
  • Accelerators
  • Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility
  • Accelerating Large Kernel Convolutions with Nested Winograd Transformation
  • A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator
  • Resiliency and Robustness
  • Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats
  • Advanced Quality Assurance Platform for Robust Process Design Kits
  • FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products
  • Radiation Tolerant 14T SRAM Cell for Avionics Applications
  • 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect.-Security and Privacy
  • Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow’s Advanced Memory Range Feature
  • Confidential Inference in Decision Trees
  • Enhancing the Security of IJTAG network using Inherently Secure SIB.

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