3rd International Congress of Electrical and Computer Engineering ICECENG 2024 /

This proceedings presents the papers included in the 3rd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 27-30 November 2024. The conference aims to bring together researchers, developers, and students in computing, technology trends, ar...

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Detalhes bibliográficos
Autor Corporativo: SpringerLink (Online service)
Outros Autores: Seyman, Muhammet Nuri (Editor)
Formato: Recurso Electrónico livro electrónico
Idioma:inglês
Publicado em: Cham : Springer Nature Switzerland : Imprint: Springer, 2025.
Edição:1st ed. 2025.
Colecção:EAI/Springer Innovations in Communication and Computing,
Assuntos:
Acesso em linha:https://doi.org/10.1007/978-3-031-88999-8
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Descrição
Resumo:This proceedings presents the papers included in the 3rd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 27-30 November 2024. The conference aims to bring together researchers, developers, and students in computing, technology trends, artificial intelligence, and security who are interested in studying the application of formal methods to the construction and analysis of models describing technological processes at both micro and macro levels. ICECENG’24 also aims to provide a platform for discussing the issues, challenges, opportunities, and findings of computer engineering research. The conference seeks to provide some answers and explore the processes, actions, challenges, and outcomes of learning and teaching. Presents papers from the 3rd International Congress of Electrical and Computer Engineering (ICECENG 2024); Brings together researchers, developers, students in computing, technology trends, artificial intelligence, and security; Provides answers and explores the processes, actions, challenges, and outcomes of current trends in EE and CE.
Descrição Física:1 online resource (XXIII, 508 p. 184 illus.). 157 illus. in color.
ISBN:9783031889998
ISSN:2522-8609
DOI:10.1007/978-3-031-88999-8