Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices /
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, begi...
Tallennettuna:
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| Yhteisötekijä: | |
| Aineistotyyppi: | Elektroninen E-kirja |
| Kieli: | englanti |
| Julkaistu: |
Wiesbaden :
Springer Fachmedien Wiesbaden : Imprint: Springer Vieweg,
2023.
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| Painos: | 1st ed. 2023. |
| Aiheet: | |
| Linkit: | https://doi.org/10.1007/978-3-658-41041-4 |
| Tagit: |
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Sisällysluettelo:
- Wafer fabrication
- Thermal oxidation
- Lithography
- Etching technology
- Doping techniques
- Chemical and Physical Deposition
- Metallization and Contacts.