Liu, G. (2024). Thermoplasmonics: From Principles, Materials and Characterization to Engineering Applications (1st ed. 2024.). Springer Nature Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-97-8332-8
Cita Chicago (17th ed.)Liu, Guohua. Thermoplasmonics: From Principles, Materials and Characterization to Engineering Applications. 1st ed. 2024. Singapore: Springer Nature Singapore : Imprint: Springer, 2024. https://doi.org/10.1007/978-981-97-8332-8.
Cita MLA (9th ed.)Liu, Guohua. Thermoplasmonics: From Principles, Materials and Characterization to Engineering Applications. 1st ed. 2024. Springer Nature Singapore : Imprint: Springer, 2024. https://doi.org/10.1007/978-981-97-8332-8.
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