Thermoplasmonics From Principles, Materials and Characterization to Engineering Applications /

This book is built on the recent advancements in understanding thermoplasmonics and highlights the exciting new directions that are shaping this field. Thermoplasmonics using light to heat nanostructures is a promising and rapidly expanding subfield of plasmonics. When the light frequency matches th...

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I tiakina i:
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Kaituhi matua: Liu, Guohua (Author)
Kaituhi rangatōpū: SpringerLink (Online service)
Hōputu: Tāhiko īPukapuka
Reo:Ingarihi
I whakaputaina: Singapore : Springer Nature Singapore : Imprint: Springer, 2024.
Putanga:1st ed. 2024.
Ngā marau:
Urunga tuihono:https://doi.org/10.1007/978-981-97-8332-8
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