SpringerLink (Online service), Tewari, A., Dhawan, N., Agarwal, G., Das, S., Mishra, S., & Karmakar, A. (2023). Proceedings of the 3rd International Conference on Advances in Materials Processing: Challenges and Opportunities: AMPCO 2022, 17-19 Oct, Roorkee, India (1st ed. 2023.). Springer Nature Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-99-1971-0
Chicago-viite (17. p.)SpringerLink (Online service), Abhishek Tewari, Nikhil Dhawan, Gautam Agarwal, Sourav Das, Sumeet Mishra, ja Anish Karmakar. Proceedings of the 3rd International Conference on Advances in Materials Processing: Challenges and Opportunities: AMPCO 2022, 17-19 Oct, Roorkee, India. 1st ed. 2023. Singapore: Springer Nature Singapore : Imprint: Springer, 2023. https://doi.org/10.1007/978-981-99-1971-0.
MLA-viite (9. p.)SpringerLink (Online service), et al. Proceedings of the 3rd International Conference on Advances in Materials Processing: Challenges and Opportunities: AMPCO 2022, 17-19 Oct, Roorkee, India. 1st ed. 2023. Springer Nature Singapore : Imprint: Springer, 2023. https://doi.org/10.1007/978-981-99-1971-0.