Cemented paste backfill : thickening, transport and mechanical properties /

This comprehensive book explores the technology and application of Cemented Paste Backfill (CPB), focusing on its thickening, transport, and mechanical properties. Authored by experts from the School of Civil and Resources Engineering at the University of Science and Technology Beijing, the book pro...

Descripció completa

Guardat en:
Dades bibliogràfiques
Autor principal: WANG, YONG
Altres autors: Xiao, Bolin
Format: Electrònic eBook
Idioma:anglès
Publicat: Amsterdam : Elsevier, 2024.
Matèries:
Accés en línia:ScienceDirect
Etiquetes: Afegir etiqueta
Sense etiquetes, Sigues el primer a etiquetar aquest registre!