APA (7th ed.) Zitazioa

Gan, C. L., & Huang, C. (2023). Interconnect Reliability in Advanced Memory Device Packaging (1st ed. 2023.). Springer International Publishing : Imprint: Springer. https://doi.org/10.1007/978-3-031-26708-6

Chicago Style (17th ed.) Zitazioa

Gan, Chong Leong, eta Chen-Yu Huang. Interconnect Reliability in Advanced Memory Device Packaging. 1st ed. 2023. Cham: Springer International Publishing : Imprint: Springer, 2023. https://doi.org/10.1007/978-3-031-26708-6.

MLA (9th ed.) Zitazioa

Gan, Chong Leong, eta Chen-Yu Huang. Interconnect Reliability in Advanced Memory Device Packaging. 1st ed. 2023. Springer International Publishing : Imprint: Springer, 2023. https://doi.org/10.1007/978-3-031-26708-6.