Interconnect Reliability in Advanced Memory Device Packaging
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect m...
-д хадгалсан:
| Үндсэн зохиолчид: | , |
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| Байгууллагын зохиогч: | |
| Формат: | Цахим Цахим ном |
| Хэл сонгох: | англи |
| Хэвлэсэн: |
Cham :
Springer International Publishing : Imprint: Springer,
2023.
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| Хэвлэл: | 1st ed. 2023. |
| Цуврал: | Springer Series in Reliability Engineering,
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| Нөхцлүүд: | |
| Онлайн хандалт: | https://doi.org/10.1007/978-3-031-26708-6 |
| Шошгууд: |
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Агуулга:
- Chapter 1: Advanced Memory and Device Packaging
- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging
- Chapter 3: Recycling of Noble Metals Used in Memory Packaging
- Chapter 4: Advanced Flip Chip Packaging
- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)
- Chapter 6: Specific Packaging Reliability Testing
- Chapter 7: Reliability Simulation and Modeling in Memory Packaging
- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.