Interconnect Reliability in Advanced Memory Device Packaging

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect m...

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Autors principals:	Gan, Chong Leong (Autor), Huang, Chen-Yu (Autor)
Autor corporatiu:	SpringerLink (Online service)
Format:	Electrònic eBook
Idioma:	anglès
Publicat:	Cham : Springer International Publishing : Imprint: Springer, 2023.
Edició:	1st ed. 2023.
Col·lecció:	Springer Series in Reliability Engineering,
Matèries:	Computers. Electronic circuits. Hardware Performance and Reliability. Electronic Circuits and Systems.
Accés en línia:	https://doi.org/10.1007/978-3-031-26708-6
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