Gan, C. L., & Huang, C. Y. (2025). Electronic Materials Innovations and Reliability in Advanced Memory Packaging (1st ed. 2025.). Springer Nature Switzerland : Imprint: Springer. https://doi.org/10.1007/978-3-031-94795-7
Čikaški stil citiranja (17. izdanje)Gan, Chong Leong, i Chen Yu Huang. Electronic Materials Innovations and Reliability in Advanced Memory Packaging. 1st ed. 2025. Cham: Springer Nature Switzerland : Imprint: Springer, 2025. https://doi.org/10.1007/978-3-031-94795-7.
MLA način citiranja (9. izdanje)Gan, Chong Leong, i Chen Yu Huang. Electronic Materials Innovations and Reliability in Advanced Memory Packaging. 1st ed. 2025. Springer Nature Switzerland : Imprint: Springer, 2025. https://doi.org/10.1007/978-3-031-94795-7.
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