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Electronic Materials Innovations and Reliability in Advanced Memory Packaging

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and...

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Bibliographic Details
Main Authors: Gan, Chong Leong (Author), Huang, Chen Yu (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:English
Published: Cham : Springer Nature Switzerland : Imprint: Springer, 2025.
Edition:1st ed. 2025.
Series:Springer Series in Reliability Engineering,
Subjects:
Electronics > Materials.
Electronic circuits.
Electronic circuit design.
Materials.
Industrial engineering.
Production engineering.
Electronic Materials.
Electronic Circuits and Systems.
Electronics Design and Verification.
Materials Engineering.
Industrial and Production Engineering.
Online Access:https://doi.org/10.1007/978-3-031-94795-7
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Summary:This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD). The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
Physical Description:1 online resource (XV, 178 p. 76 illus.). 69 illus. in color.
ISBN:9783031947957
ISSN:2196-999X
DOI:10.1007/978-3-031-94795-7

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