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Electronic Materials Innovations and Reliability in Advanced Memory Packaging

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and...

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Ngā taipitopito rārangi puna kōrero
Ngā kaituhi matua:	Gan, Chong Leong (Author), Huang, Chen Yu (Author)
Kaituhi rangatōpū:	SpringerLink (Online service)
Hōputu:	Tāhiko īPukapuka
Reo:	Ingarihi
I whakaputaina:	Cham : Springer Nature Switzerland : Imprint: Springer, 2025.
Putanga:	1st ed. 2025.
Rangatū:	Springer Series in Reliability Engineering,
Ngā marau:	Electronics > Materials. Electronic circuits. Electronic circuit design. Materials. Industrial engineering. Production engineering. Electronic Materials. Electronic Circuits and Systems. Electronics Design and Verification. Materials Engineering. Industrial and Production Engineering.
Urunga tuihono:	https://doi.org/10.1007/978-3-031-94795-7
Ngā Tūtohu:	Tāpirihia he Tūtohu Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!

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