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Electronic Materials Innovations and Reliability in Advanced Memory Packaging

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and...

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Detalles Bibliográficos
Main Authors: Gan, Chong Leong (Author), Huang, Chen Yu (Author)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:inglés
Publicado: Cham : Springer Nature Switzerland : Imprint: Springer, 2025.
Edición:1st ed. 2025.
Series:Springer Series in Reliability Engineering,
Subjects:
Electronics > Materials.
Electronic circuits.
Electronic circuit design.
Materials.
Industrial engineering.
Production engineering.
Electronic Materials.
Electronic Circuits and Systems.
Electronics Design and Verification.
Materials Engineering.
Industrial and Production Engineering.
Acceso en liña:https://doi.org/10.1007/978-3-031-94795-7
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Table of Contents:
  • Influences of Electronic Materials Properties on Packaging Reliability
  • Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging
  • Materials Development for Future Data Center Applications
  • Advanced Chiplets and Heterogenous Integration in Memory Device Packaging
  • Hybrid Bonding Device Packaging
  • Hardware Reliability for Memory Modules and SSDs
  • Innovative Sustainable Electronics Materials in Advanced Memory Packaging
  • PCB and Substrate in Future Memory Applications.

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