Electronic Materials Innovations and Reliability in Advanced Memory Packaging

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and...

Description complète

Détails bibliographiques

Auteurs principaux:	Gan, Chong Leong (Auteur), Huang, Chen Yu (Auteur)
Collectivité auteur:	SpringerLink (Online service)
Format:	Électronique eBook
Langue:	anglais
Publié:	Cham : Springer Nature Switzerland : Imprint: Springer, 2025.
Édition:	1st ed. 2025.
Collection:	Springer Series in Reliability Engineering,
Sujets:	Electronics > Materials. Electronic circuits. Electronic circuit design. Materials. Industrial engineering. Production engineering. Electronic Materials. Electronic Circuits and Systems. Electronics Design and Verification. Materials Engineering. Industrial and Production Engineering.
Accès en ligne:	https://doi.org/10.1007/978-3-031-94795-7
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!