APA-ийн эшлэл(7 дахь хэвлэлт)

Lau, J. H. (2023). Chiplet Design and Heterogeneous Integration Packaging (1st ed. 2023.). Springer Nature Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-19-9917-8

Чикаго-гийн эшлэл (17 дахь хэвлэлт)

Lau, John H. Chiplet Design and Heterogeneous Integration Packaging. 1st ed. 2023. Singapore: Springer Nature Singapore : Imprint: Springer, 2023. https://doi.org/10.1007/978-981-19-9917-8.

MLA -ийн эшлэл (9 дэх хэвлэлт)

Lau, John H. Chiplet Design and Heterogeneous Integration Packaging. 1st ed. 2023. Springer Nature Singapore : Imprint: Springer, 2023. https://doi.org/10.1007/978-981-19-9917-8.