Chiplet Design and Heterogeneous Integration Packaging
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a...
Furkejuvvon:
| Váldodahkki: | |
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| Searvvušdahkki: | |
| Materiálatiipa: | Elektrovnnalaš E-girji |
| Giella: | eaŋgalasgiella |
| Almmustuhtton: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2023.
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| Preanttus: | 1st ed. 2023. |
| Fáttát: | |
| Liŋkkat: | https://doi.org/10.1007/978-981-19-9917-8 |
| Fáddágilkorat: |
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| Čoahkkáigeassu: | The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. |
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| Olgguldas hápmi: | 1 online resource (XXII, 525 p. 543 illus.). 501 illus. in color. |
| ISBN: | 9789811999178 |
| DOI: | 10.1007/978-981-19-9917-8 |