Chiplet Design and Heterogeneous Integration Packaging

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a...

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Bibliografske podrobnosti

Glavni avtor:	Lau, John H. (Author)
Korporativna značnica:	SpringerLink (Online service)
Format:	Elektronski eKnjiga
Jezik:	angleščina
Izdano:	Singapore : Springer Nature Singapore : Imprint: Springer, 2023.
Izdaja:	1st ed. 2023.
Teme:	Electronics. Electronic circuits. Microtechnology. Microelectromechanical systems. Electronics and Microelectronics, Instrumentation. Electronic Circuits and Systems. Microsystems and MEMS.
Online dostop:	https://doi.org/10.1007/978-981-19-9917-8
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