Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /

This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of e...

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Detalles Bibliográficos

Autor Corporativo:	SpringerLink (Online service)
Outros autores:	Abdul Razak, Nurul Razliana (Editor), Mohd Salleh, Mohd Arif Anuar (Editor), Che Halin, Dewi Suriyani (Editor), Abdul Razak, Kamrosni (Editor), Somidin, Flora (Editor), Baser, Muhammad Fadlin Hazim (Editor)
Formato:	Electrónico eBook
Idioma:	inglés
Publicado:	Singapore : Springer Nature Singapore : Imprint: Springer, 2025.
Edición:	1st ed. 2025.
Series:	Springer Proceedings in Physics, 418
Subjects:	Surfaces (Physics). Green chemistry. Solid state physics. Electronics. Sustainability. Surface and Interface and Thin Film. Green Chemistry. Electronic Devices. Electronics and Microelectronics, Instrumentation.
Acceso en liña:	https://doi.org/10.1007/978-981-96-2871-1
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