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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /

This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of e...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Abdul Razak, Nurul Razliana (Editor), Mohd Salleh, Mohd Arif Anuar (Editor), Che Halin, Dewi Suriyani (Editor), Abdul Razak, Kamrosni (Editor), Somidin, Flora (Editor), Baser, Muhammad Fadlin Hazim (Editor)
Format: Electronic eBook
Language:English
Published: Singapore : Springer Nature Singapore : Imprint: Springer, 2025.
Edition:1st ed. 2025.
Series:Springer Proceedings in Physics, 418
Subjects:
Surfaces (Physics).
Green chemistry.
Solid state physics.
Electronics.
Sustainability.
Surface and Interface and Thin Film.
Green Chemistry.
Electronic Devices.
Electronics and Microelectronics, Instrumentation.
Online Access:https://doi.org/10.1007/978-981-96-2871-1
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Summary:This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.
Physical Description:XIII, 421 p. 168 illus., 154 illus. in color. online resource.
ISBN:9789819628711
ISSN:1867-4941 ;
DOI:10.1007/978-981-96-2871-1

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