Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of e...
I tiakina i:
| Kaituhi rangatōpū: | SpringerLink (Online service) |
|---|---|
| Ētahi atu kaituhi: | Abdul Razak, Nurul Razliana (Editor), Mohd Salleh, Mohd Arif Anuar (Editor), Che Halin, Dewi Suriyani (Editor), Abdul Razak, Kamrosni (Editor), Somidin, Flora (Editor), Baser, Muhammad Fadlin Hazim (Editor) |
| Hōputu: | Tāhiko īPukapuka |
| Reo: | Ingarihi |
| I whakaputaina: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2025.
|
| Putanga: | 1st ed. 2025. |
| Rangatū: | Springer Proceedings in Physics,
418 |
| Ngā marau: | |
| Urunga tuihono: | https://doi.org/10.1007/978-981-96-2871-1 |
| Ngā Tūtohu: |
Tāpirihia he Tūtohu
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|
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Ngā tūemi rite
-
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium EPITS 2022, 14-15 September, Langkawi, Malaysia /
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Proceedings of the 3rd International Conference on Advanced Surface Enhancement (INCASE) 2023 Surface Engineering for Sustainability /
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I whakaputaina: (2024) -
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