Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of e...
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| Corporate Author: | |
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| Other Authors: | , , , , , |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2025.
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| Edition: | 1st ed. 2025. |
| Series: | Springer Proceedings in Physics,
418 |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/978-981-96-2871-1 |
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