Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium EPITS 2024, 26-27 August, Ho Chi Minh City, Vietnam /

This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of e...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Abdul Razak, Nurul Razliana (Editor), Mohd Salleh, Mohd Arif Anuar (Editor), Che Halin, Dewi Suriyani (Editor), Abdul Razak, Kamrosni (Editor), Somidin, Flora (Editor), Baser, Muhammad Fadlin Hazim (Editor)
Format: Electronic eBook
Language:English
Published: Singapore : Springer Nature Singapore : Imprint: Springer, 2025.
Edition:1st ed. 2025.
Series:Springer Proceedings in Physics, 418
Subjects:
Online Access:https://doi.org/10.1007/978-981-96-2871-1
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