Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...
Furkejuvvon:
| Váldodahkkit: | , |
|---|---|
| Searvvušdahkki: | |
| Materiálatiipa: | Elektrovnnalaš E-girji |
| Giella: | eaŋgalasgiella |
| Almmustuhtton: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2025.
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| Preanttus: | 1st ed. 2025. |
| Fáttát: | |
| Liŋkkat: | https://doi.org/10.1007/978-981-96-4166-6 |
| Fáddágilkorat: |
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