APA (7th ed.) Citation

Lau, J., & Fan, X. (2025). Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration (1st ed. 2025.). Springer Nature Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-96-4166-6

Chicago Style (17th ed.) Citation

Lau, John, and Xuejun Fan. Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration. 1st ed. 2025. Singapore: Springer Nature Singapore : Imprint: Springer, 2025. https://doi.org/10.1007/978-981-96-4166-6.

MLA (9th ed.) Citation

Lau, John, and Xuejun Fan. Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration. 1st ed. 2025. Springer Nature Singapore : Imprint: Springer, 2025. https://doi.org/10.1007/978-981-96-4166-6.