Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...
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| Main Authors: | , |
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| Format: | Electronic eBook |
| Language: | English |
| Published: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2025.
|
| Edition: | 1st ed. 2025. |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/978-981-96-4166-6 |
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| 245 | 1 | 0 | |a Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration |h [electronic resource] / |c by John Lau, Xuejun Fan. |
| 250 | |a 1st ed. 2025. | ||
| 264 | 1 | |a Singapore : |b Springer Nature Singapore : |b Imprint: Springer, |c 2025. | |
| 300 | |a 1 online resource (XXIV, 645 p. 623 illus.). |b 557 illus. in color. | ||
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| 341 | 0 | |b Use of color is not sole means of conveying information |2 onix | |
| 341 | 0 | |b Use of high contrast between text and background color |2 onix | |
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| 341 | 0 | |b All non-decorative content supports reading without sight |2 onix | |
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| 505 | 0 | |a Chiplet Design and Heterogeneous Integration Packaging -- Advanced Substrates for Chiplet and Heterogeneous Integration -- Cu-Cu Bumpless Hybrid Bonding -- Warpage Management in Semiconductor Packaging -- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint -- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling -- Design Rules for Electromigration Failure -- Thermal Management. | |
| 520 | |a The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration. | ||
| 532 | 8 | |a Accessibility summary: This PDF does not fully comply with PDF/UA standards, but does feature limited screen reader support, described non-text content (images, graphs), bookmarks for easy navigation and searchable, selectable text. Users of assistive technologies may experience difficulty navigating or interpreting content in this document. We recognize the importance of accessibility, and we welcome queries about accessibility for any of our products. If you have a question or an access need, please get in touch with us at accessibilitysupport@springernature.com. | |
| 532 | 8 | |a No reading system accessibility options actively disabled | |
| 532 | 8 | |a Publisher contact for further accessibility information: accessibilitysupport@springernature.com | |
| 588 | |a Print version record. | ||
| 650 | 0 | |a Electronic circuit design. | |
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Semiconductors. | |
| 650 | 0 | |a Production engineering. | |
| 650 | 1 | 4 | |a Electronics Design and Verification. |
| 650 | 2 | 4 | |a Electronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | |a Semiconductors. |
| 650 | 2 | 4 | |a Process Engineering. |
| 700 | 1 | |a Fan, Xuejun. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
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| 950 | |a Focus Bundle Electrical and Electronic Engineering (SpringerNature-85403) | ||