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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...

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Detalles Bibliográficos
Autores principales:	Lau, John (Autor), Fan, Xuejun (Autor)
Autor Corporativo:	SpringerLink (Online service)
Formato:	Electrónico eBook
Lenguaje:	inglés
Publicado:	Singapore : Springer Nature Singapore : Imprint: Springer, 2025.
Edición:	1st ed. 2025.
Materias:	Electronic circuit design. Electronics. Semiconductors. Production engineering. Electronics Design and Verification. Electronics and Microelectronics, Instrumentation. Process Engineering.
Acceso en línea:	https://doi.org/10.1007/978-981-96-4166-6
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!

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