Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...
Tallennettuna:
| Päätekijät: | , |
|---|---|
| Yhteisötekijä: | |
| Aineistotyyppi: | Elektroninen E-kirja |
| Kieli: | englanti |
| Julkaistu: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2025.
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| Painos: | 1st ed. 2025. |
| Aiheet: | |
| Linkit: | https://doi.org/10.1007/978-981-96-4166-6 |
| Tagit: |
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Sisällysluettelo:
- Chiplet Design and Heterogeneous Integration Packaging
- Advanced Substrates for Chiplet and Heterogeneous Integration
- Cu-Cu Bumpless Hybrid Bonding
- Warpage Management in Semiconductor Packaging
- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint
- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling
- Design Rules for Electromigration Failure
- Thermal Management.