Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved...

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Bibliographic Details

Main Authors:	Lau, John (Author), Fan, Xuejun (Author)
Corporate Author:	SpringerLink (Online service)
Format:	Electronic eBook
Language:	English
Published:	Singapore : Springer Nature Singapore : Imprint: Springer, 2025.
Edition:	1st ed. 2025.
Subjects:	Electronic circuit design. Electronics. Semiconductors. Production engineering. Electronics Design and Verification. Electronics and Microelectronics, Instrumentation. Process Engineering.
Online Access:	https://doi.org/10.1007/978-981-96-4166-6
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