Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study...
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| Format: | Electronisk eBog |
| Sprog: | engelsk |
| Udgivet: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2024.
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| Udgivelse: | 1st ed. 2024. |
| Fag: | |
| Online adgang: | https://doi.org/10.1007/978-981-97-2140-5 |
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