APA (7th ed.) Citation

Lau, J. H. (2024). Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology (1st ed. 2024.). Springer Nature Singapore : Imprint: Springer. https://doi.org/10.1007/978-981-97-2140-5

Chicago Style (17th ed.) Citation

Lau, John H. Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology. 1st ed. 2024. Singapore: Springer Nature Singapore : Imprint: Springer, 2024. https://doi.org/10.1007/978-981-97-2140-5.

MLA (9th ed.) Citation

Lau, John H. Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology. 1st ed. 2024. Springer Nature Singapore : Imprint: Springer, 2024. https://doi.org/10.1007/978-981-97-2140-5.