Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study...
Zapisane w:
| 1. autor: | |
|---|---|
| Korporacja: | |
| Format: | Elektroniczne E-book |
| Język: | angielski |
| Wydane: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2024.
|
| Wydanie: | 1st ed. 2024. |
| Hasła przedmiotowe: | |
| Dostęp online: | https://doi.org/10.1007/978-981-97-2140-5 |
| Etykiety: |
Dodaj etykietę
Nie ma etykietki, Dołącz pierwszą etykiete!
|
| Streszczenie: | This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc. |
|---|---|
| Opis fizyczny: | 1 online resource (XX, 501 p. 556 illus.). 520 illus. in color. |
| ISBN: | 9789819721405 |
| DOI: | 10.1007/978-981-97-2140-5 |