Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study...
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| Format: | Elektronisch E-Book |
| Sprache: | Englisch |
| Veröffentlicht: |
Singapore :
Springer Nature Singapore : Imprint: Springer,
2024.
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| Ausgabe: | 1st ed. 2024. |
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| Online-Zugang: | https://doi.org/10.1007/978-981-97-2140-5 |
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| 100 | 1 | |a Lau, John H. |e author. |4 aut |4 http://id.loc.gov/vocabulary/relators/aut | |
| 245 | 1 | 0 | |a Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology |h [electronic resource] / |c by John H. Lau. |
| 250 | |a 1st ed. 2024. | ||
| 264 | 1 | |a Singapore : |b Springer Nature Singapore : |b Imprint: Springer, |c 2024. | |
| 300 | |a 1 online resource (XX, 501 p. 556 illus.). |b 520 illus. in color. | ||
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| 337 | |a computer |b c |2 rdamedia | ||
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| 341 | 0 | |b All non-decorative content supports reading without sight |2 onix | |
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| 505 | 0 | |a -- Flip Chip Technology -- Cu-Cu Hybrid Bonding -- Fan-In Technology -- Fan-Out Technology -- Chiplet Communications (Bridges) -- Co-Packaged Optics. | |
| 520 | |a This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics. The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc. | ||
| 532 | 8 | |a Accessibility summary: This PDF does not fully comply with PDF/UA standards, but does feature limited screen reader support, described non-text content (images, graphs), bookmarks for easy navigation and searchable, selectable text. Users of assistive technologies may experience difficulty navigating or interpreting content in this document. We recognize the importance of accessibility, and we welcome queries about accessibility for any of our products. If you have a question or an access need, please get in touch with us at accessibilitysupport@springernature.com. | |
| 532 | 8 | |a No reading system accessibility options actively disabled | |
| 532 | 8 | |a Publisher contact for further accessibility information: accessibilitysupport@springernature.com | |
| 588 | |a Print version record. | ||
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Solid state physics. | |
| 650 | 0 | |a Lasers. | |
| 650 | 0 | |a Optics. | |
| 650 | 1 | 4 | |a Electronics and Microelectronics, Instrumentation. |
| 650 | 2 | 4 | |a Electronic Devices. |
| 650 | 2 | 4 | |a Laser Technology. |
| 650 | 2 | 4 | |a Optics and Photonics. |
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