Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study...

Volledige beschrijving

Bewaard in:
Bibliografische gegevens
Hoofdauteur: Lau, John H. (Auteur)
Coauteur: SpringerLink (Online service)
Formaat: Elektronisch E-boek
Taal:Engels
Gepubliceerd in: Singapore : Springer Nature Singapore : Imprint: Springer, 2024.
Editie:1st ed. 2024.
Onderwerpen:
Online toegang:https://doi.org/10.1007/978-981-97-2140-5
Tags: Voeg label toe
Geen labels, Wees de eerste die dit record labelt!

Gelijkaardige items