Obálka

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study...

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Hlavní autor: Lau, John H. (Autor)
Korporativní autor: SpringerLink (Online service)
Médium: Elektronický zdroj E-kniha
Jazyk:angličtina
Vydáno: Singapore : Springer Nature Singapore : Imprint: Springer, 2024.
Vydání:1st ed. 2024.
Témata:
Electronics.
Solid state physics.
Lasers.
Optics.
Electronics and Microelectronics, Instrumentation.
Electronic Devices.
Laser Technology.
Optics and Photonics.
On-line přístup:https://doi.org/10.1007/978-981-97-2140-5
Tagy: Přidat tag
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Obsah:
  • -- Flip Chip Technology
  • Cu-Cu Hybrid Bonding
  • Fan-In Technology
  • Fan-Out Technology
  • Chiplet Communications (Bridges)
  • Co-Packaged Optics.

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