Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study...

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書目詳細資料

主要作者:	Lau, John H. (Author)
企業作者:	SpringerLink (Online service)
格式:	電子 電子書
語言:	英语
出版:	Singapore : Springer Nature Singapore : Imprint: Springer, 2024.
版:	1st ed. 2024.
主題:	Electronics. Solid state physics. Lasers. Optics. Electronics and Microelectronics, Instrumentation. Electronic Devices. Laser Technology. Optics and Photonics.
在線閱讀:	https://doi.org/10.1007/978-981-97-2140-5
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